Surface mount PCB assembly for production orders
At the centre of our surface mount PCB assembly operation is the very latest in SMT print, placement and inspection technology.
Our surface mount production department is equipped with advanced MYDATA technology for fast and reliable production. We currently manufacture over 80,000 PCB assemblies a year, ranging from quick turn prototypes to batch production orders. We are focused on surface mount products for high reliability applications for batch sizes 1 to 1000 units.
Our fully automated 'Synergy' line consists of two MYDATA surface mount machines working in-line for high speed SMT production. We use automatic board handling with full conveyance, moving pasted PCB's through the complete SMT process. The 'Synergy' approach allows us to provide complete flexibility, by using 1 or 2 SMT machines when higher volumes are produced.
Our entire SMT process is supported with solder jet printing, allowing us to manufacture with the latest array of component technology, including PoP (Package on Package) with high yield performance.
Key elements of our complex PCB assembly facility:
- 3 SMT placement machines.
- 'Synergy' approach for flexible and scalable production.
- Leading edge solder jet printing technology
- Automated PCB handling, for optimum cost and quality.
- In-line electrical verification on SMT lines.
- Package-on-Package, 0.4 mm PoP BGA assembly.
- BGA assembly, µBGA, 01005, 0201, 0402.
- Bespoke thermal engineering.
- Automated optical inspection, 2 x MIRTEC systems with multi-angled capability.
- X-Ray, Ersascope, ERSA650 IR station.
- No clean process & ultrasonic cleaning.
All PCBA production is supported by state-of-the-art solder jet printing to optimise the solder paste process. Only the correct amount of paste is applied to each and every footprint to ensure the optimum reflow conditions are achieved. This technology provides high yield products and removes all typical production errors and hidden manufacturing costs.
Complex PCB assemblies receive our technical NPI process, including full thermal profile verification, ensuring product conformance. In-process inspection is completed by experienced IPC trained quality engineers, using MIRTEC AOI systems. Our build process is supported with a range of inspection tools, such as Ersascope optical cameras and 3D x-ray.
We use powerful resource planning software to accurately organise and plan our workflow. Our dedicated engineering team carefully analyse and check incoming data and produce comprehensive data packs to support the build process. Reporting is available with the use of real time data capture, with dedicated communication channels are in place to support customers through all aspects of manufacturing.
If you are looking to work with a manufacture of high quality surface mount PCB products, Gemini Tec provide a range of scalable solutions to ensure cost effective outsourcing for small to medium batch products.
Contact us to arrange a meeting to discuss your requirements in more detail.
Tel +44 (0) 1252 333 444.
Customer feedback on the service we provide:
"Using Gemini Tec has been a breath of fresh air, delivering product on time and often ahead of planned deliveries to aid DSL in delivering urgent orders to its customers. DSL has historically worked with at least 2 sub-contract manufacturers, but given our confidence in your service and ability we have attained over the years, we have taken the unprecedented move to single source with Gemini"